The processing quality factors of the diamond wire drawing die itself lead to mold wear,asymmetric inlay between the diamond dies blank and the die steel sleeve,uneven distribution or gaps in the sintered hard alloy steel sleeve,which can easily cause U-shaped cracks during the wire drawing process. During the laser drilling process,incomplete cleaning of sintering marks or uneven heating can lead to the accumulation of metal catalysts in the diamond layer,which can easily lead to mold pits during the wire drawing process.The design of the mold hole is unreasonable,the opening of the inlet lubrication area is too small,and the forming area is too long,which can lead to poor lubrication,leading to dies wear and even rupture.
Improper use during the wire drawing process leads to mold wear.Excessive surface shrinkage during wire drawing can lead to dies cracking or breakage Most cracks or fractures are caused by internal stress release.In any material structure, internal stress is inevitable. The internal stress generated during pulling can enhance the diamond microcrystalline structure,but when the surface shrinkage rate of the pulling wire is too large,it cannot be lubricated in a timely manner,and the temperature rise is too high,the diamond dies indicates that some materials have been removed, and the stress of the microcrystalline structure greatly increases,making it easier to crack or break.The asymmetry between the wire drawing dies and the centerline of the mold hole leads to uneven stress distribution between the wire and the dies.The impact of mechanical vibration can also cause high stress peaks on the wire and dies,accelerating mold wear.
Reasons for wear of diamond wire drawing dies
The processing quality factors of the diamond wire drawing die itself lead to mold wear,asymmetric inlay between the diamond dies blank and the die steel sleeve,uneven distribution or gaps in the sintered hard alloy steel sleeve,which can easily cause U-shaped cracks during the wire drawing process. During the laser drilling process,incomplete cleaning of sintering marks or uneven heating can lead to the accumulation of metal catalysts in the diamond layer,which can easily lead to mold pits during the wire drawing process.The design of the mold hole is unreasonable,the opening of the inlet lubrication area is too small,and the forming area is too long,which can lead to poor lubrication,leading to dies wear and even rupture.
Improper use during the wire drawing process leads to mold wear.Excessive surface shrinkage during wire drawing can lead to dies cracking or breakage Most cracks or fractures are caused by internal stress release.In any material structure, internal stress is inevitable. The internal stress generated during pulling can enhance the diamond microcrystalline structure,but when the surface shrinkage rate of the pulling wire is too large,it cannot be lubricated in a timely manner,and the temperature rise is too high,the diamond dies indicates that some materials have been removed, and the stress of the microcrystalline structure greatly increases,making it easier to crack or break.The asymmetry between the wire drawing dies and the centerline of the mold hole leads to uneven stress distribution between the wire and the dies.The impact of mechanical vibration can also cause high stress peaks on the wire and dies,accelerating mold wear.
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